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NEW: SIPLACE SpeedStar with up to 48,000 cph and maximum component size of 8.2 mm x 8.2 mm x 4 mm with a placement accuracy of up to 25 µm/3 sigma SIPLACE MultiStar: Up to 25,500 cph SIPLACE TwinStar: The head for special tasks SIPLACE JEDEC Tray Feeder with up to 18 JEDEC trays SIPLACE TX micron: Placement accuracy of up to 15 µm @ 3 sigma |
More flexibility and performance through the combination of SIPLACE SpeedStar and SIPLACE MultiStar heads in a single placement area Placement force down to 0.5 N for sensitive components Touchless placement: Maximum placement quality for highly sensitive components NEW: SIPLACE Smart Pin Support: Automated pin mounting for printed circuit boards NEW: Maximum PCB size 550 mm x 460 mm |